Test substation for testing semi-conductor packages

Details Test substation for testing semi-conductor packages Test substation for testing semi-conductor packages

1993-03-25

1994-04-26

Nguyen, Vinh

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324158P, 439 71, G01R 3126

Patent

active

053070127

ABSTRACT:
A test apparatus that electrically couples a semiconductor package with a test board. The apparatus has a plurality of first contacts that engage the leads of the package. The first contacts are attached to a housing which has four grounding rods spaced a predetermined distance from the first contacts. The rods are electrically grounded and absorb the inductive fields generated by the first contacts in contact with the power and ground leads of the package. The rods extend around the package to control the inductance of the first contacts of the apparatus. The test apparatus may also have a circuit board connected to the first contacts by a plurality of second contacts. A number of spring biased pins are incorporated to couple the circuit board to the test board. The circuit board has both power and ground planes that are coupled to the power and ground leads of the package. The circuit board decouples the power and ground leads and controls the capacitance of the first contacts of the apparatus.

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