Test structure for determining the stability of electronic...

Details Test structure for determining the stability of electronic... Test structure for determining the stability of electronic...

2005-03-15

2005-03-15

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB

Reexamination Certificate

active

06867610

ABSTRACT:
The present invention allows testing of bump connections under predefined conditions. To this end, a test structure including two substrates, each substrate having bond pads that are provided for flip-chip connecting both substrates. These bond pads may have electrical contact to other bond pads and/or special probe pads which are provided for making electrical connections to external devices. Electrically conductive bumps are formed on at least some of the bond pads of one of the substrates, and the bumps are electrically and mechanically connected to the bond pads in the other substrate.

REFERENCES:
patent: 5477160 (1995-12-01), Love
patent: 6133744 (2000-10-01), Yojima et al.
patent: 6466038 (2002-10-01), Pekin et al.
patent: 6635970 (2003-10-01), Lasky et al.
patent: 0 813 238 (1997-12-01), None
patent: 10115657 (1998-05-01), None
Lozano et al., “Test Structures for MCM-D Technology Characterization,”IEEE Transactions on Semiconductor Manufacturing, 12:184-92, 1999.
Zhang and Baldwin, “Reliability Assessment of Flip Chip on Organic Board Using Power Cycling Techniques,”2002 Electronic Components and Technology Conference, pp. 962-967, 2002, no month.

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