Test structure for determining the electrical loadability of...

Details Test structure for determining the electrical loadability of... Test structure for determining the electrical loadability of...

2005-05-31

2005-05-31

Gilman, Alexander (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

C257S752000

Reexamination Certificate

active

06899543

ABSTRACT:
A test structure can be used to determine the electrical loadability of contacts. This structure includes a first interconnect line and a second interconnect line arranged above the first interconnect line. A via electrically couples the first interconnect line to the second interconnect line. A plurality of additional conductive structures are arranged in a closely adjacent manner around the via. These additional structures lie in the same plane as either the first interconnect line or the second interconnect line.

REFERENCES:
patent: 5929528 (1999-07-01), Kinugawa
patent: 6413847 (2002-07-01), Yeh et al.
patent: 6600227 (2003-07-01), Chiu et al.
patent: 63236319 (1988-10-01), None
patent: 09321248 (1997-12-01), None
patent: WO 02/067318 (2002-08-01), None

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