Test socket for surface mount device packages

Details Test socket for surface mount device packages Test socket for surface mount device packages

1998-11-02

2000-09-26

Metjahic, Safet

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, 439 66, 439 73, G01R 3102, H01R 1200

Patent

active

061247200

ABSTRACT:
Surface mount test and/or burn-in sockets for electronic device packages are formed using contact pins supported between the top of a circuit board and the lower surface of the terminal lead. The central portion of each contact pin is secured in the socket base so that one end of the pin extends into a cavity in the socket and the other end extends from the lower surface of the socket. The ends of the contact pins are supported on curved beams which are designed to control the pressure exerted on the terminal leads and on the contact pads independently.

REFERENCES:
patent: 4683423 (1987-07-01), Morton
patent: 5108302 (1992-04-01), Pfaff
patent: 5308256 (1994-05-01), Tonooka et al.
patent: 5764072 (1998-06-01), Kister
patent: 5847572 (1998-12-01), Iwasaki et al.

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