Test socket and test board for wafer level semiconductor...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S765010

Reexamination Certificate

active

07576551

ABSTRACT:
A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws.

REFERENCES:
patent: 5576630 (1996-11-01), Fujita
patent: 6204681 (2001-03-01), Nagatsuka et al.
patent: 6483331 (2002-11-01), Tamaru et al.
patent: 6559665 (2003-05-01), Barabi
patent: 6566899 (2003-05-01), Tamaru et al.
patent: 6891386 (2005-05-01), Matsuzawa

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