Test probe for leadless devices

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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324158F, 439626, 439482, H01R 911, H01R 2302

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active

047053330

ABSTRACT:
An electrical test probe assembly for use with a leadless surface mounted device is provided which includes an array of resilient spring contacts in a pattern corresponding to the contacts of a leadless device. The array of spring contacts are configured to grip the peripheral edges of a surface mounted device, with each spring contact in biased engagement with a respective contact of the device.

REFERENCES:
patent: 3646579 (1972-02-01), DiVita et al.
patent: 3885854 (1975-05-01), Reimer
patent: 3952218 (1976-04-01), Deters
patent: 4538864 (1985-09-01), Ichimura
patent: 4639058 (1987-01-01), Morgan
"High-Speed, Low Crosstalk Chip Holder for Josephson Integrated Circuits", by Hamilton, IEEE Transactions, vol. IM-31, No. 2, Jun. 1982.

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