Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1985-08-21
1987-11-10
Weidenfeld, Gil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
324158F, 439626, 439482, H01R 911, H01R 2302
Patent
active
047053330
ABSTRACT:
An electrical test probe assembly for use with a leadless surface mounted device is provided which includes an array of resilient spring contacts in a pattern corresponding to the contacts of a leadless device. The array of spring contacts are configured to grip the peripheral edges of a surface mounted device, with each spring contact in biased engagement with a respective contact of the device.
REFERENCES:
patent: 3646579 (1972-02-01), DiVita et al.
patent: 3885854 (1975-05-01), Reimer
patent: 3952218 (1976-04-01), Deters
patent: 4538864 (1985-09-01), Ichimura
patent: 4639058 (1987-01-01), Morgan
"High-Speed, Low Crosstalk Chip Holder for Josephson Integrated Circuits", by Hamilton, IEEE Transactions, vol. IM-31, No. 2, Jun. 1982.
Alden, III Wayne S.
Pedro Brian A.
Sicard Stephen T.
Paumen Gary F.
Pylon Company, Inc.
Weidenfeld Gil
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