Test probe assembly using buckling wire probes within tubes havi

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324754, G01R 3102

Patent

active

053672542

ABSTRACT:
A test probe assembly is disclosed having bucking beam displacement test probe units which are easily replaceable. Each test probe unit includes a wire and a slotted tube containing the wire,one end of the wire being attached to one end of the tube and the other end of the wire protruding from the other end of the tube. The wire slidably engages an inner diameter of the tube. Each tube is slotted at a plurality of locations along the longitudinal axis thereof to provide spaces for the buckling beam displacement of the respective wire when the protruding end of the wire is brought to bear against a device point to be tested. The slots are staggered so that adjacent ones are disposed radially opposite to each other with some overlap along the longitudinal axis of the tube. The test probe units are inserted in predetermined respective holes of an apertured block of insulating material in accordance with a pattern of device points to be tested.

REFERENCES:
patent: 3806801 (1974-04-01), Bove
patent: 4423376 (1983-12-01), Byrnes et al.
patent: 4505529 (1985-03-01), Barkus
patent: 4506215 (1985-03-01), Coughlin
patent: 4622514 (1986-11-01), Lewis
patent: 4686464 (1987-08-01), Elsasser et al.
patent: 4764722 (1988-08-01), Coughlin et al.
patent: 4816754 (1989-03-01), Buechele et al.
patent: 4843315 (1989-06-01), Bayer et al.
patent: 4931726 (1990-06-01), Kasukabe et al.
patent: 5192213 (1993-03-01), Kosugi et al.
Faure, L. H. "Test Probe", IBM Technical Disclosure Bulletin, vol. 18, No. 8, Jan. 1976, pp. 2527-2528.
Auerbach, I. et al. "Trilead Connector Assembly Tool", IBM Technical Disclosure Bulletin, vol. 23, No. 6, Nov. 1980, pp. 2379-2381.
Lipschutz, L. D. et al. "Buckling Wire Probe Assembly", IBM Technical Disclosure Bulletin, vol. 15, No. 10, Mar. 1973, pp. 3032-3034.
Buyck, W. J. "Twin-Lead Contact Probe", IBM Technical Disclosure Bulletin, vol. 14, No. 2, Jul. 1971, p. 558.

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