Test pattern of semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks

Reexamination Certificate

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Details

C257S758000

Reexamination Certificate

active

07030507

ABSTRACT:
Disclosed is a test pattern comprising: lower metal patterns for test formed in such a manner that crank-type patterns are arranged in sequence overlapping on each other in a view along a vertical line; hole patterns formed in such a manner that each of the hole patterns exposes either a front end and a rear end of each crank-type lower metal pattern; and upper metal patterns formed in such a manner that each upper metal pattern interconnects a front end of each lower metal pattern and a rear end of an adjacent lower metal pattern overlapping on each other in a view along a vertical line.

REFERENCES:
patent: 3922707 (1975-11-01), Freed et al.
patent: 6042933 (2000-03-01), Hirai et al.
patent: 6232619 (2001-05-01), Chen et al.
patent: 6559475 (2003-05-01), Kim
patent: 6577149 (2003-06-01), Doong et al.
patent: 6787800 (2004-09-01), Weiland et al.

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