Test pattern for testing contact resistance of a subject via...

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters

Reexamination Certificate

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C324S713000, C324S763010, C324S765010, C257S048000

Reexamination Certificate

active

07053634

ABSTRACT:
A test pattern for testing contact resistance of a subject via hole. The test pattern includes first and second conductive patterns respectively formed on lower and upper substrate surfaces and connected to the subject via hole. First and second electrodes are formed on the second conductive pattern. Third and fourth electrodes are formed on the substrate upper surface. First and second test via-holes are formed through the substrate to connect the first conductive pattern to the third electrode and the first conductive pattern to the fourth electrode, respectively. The first and third electrodes are connected to a current test probe so that a test current flows through the first electrode, the subject via hole, the test via-hole and then the third electrode. The second and fourth electrodes are connected to a voltage test probe so as that a test voltage is applied through the second electrode, the subject via hole, the second test via-hole and then the fourth electrode.

REFERENCES:
patent: 5640097 (1997-06-01), Hada
patent: 5663651 (1997-09-01), Hada
patent: 6054720 (2000-04-01), Fieselman et al.
patent: 6362638 (2002-03-01), Ashton et al.
patent: 04-0077851 (1992-01-01), None
patent: 06-123759 (1994-05-01), None

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