Test pattern for analyzing delay characteristic of...

Details Test pattern for analyzing delay characteristic of... Test pattern for analyzing delay characteristic of...

2006-12-21

2009-12-22

Dole, Timothy J (Department: 2831)

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Lumped type parameters

C324S617000, C324S076350, C324S076640

Reexamination Certificate

active

07635985

ABSTRACT:
A test pattern for analyzing a delay characteristic of an interconnection line and a method of analyzing a delay characteristic of an interconnection line using the test pattern are provided. The test pattern for analyzing a delay characteristic of an interconnection line includes: a first metal line formed as a snake shaped structure having a plurality of concave-convex sections each having the same width; a second metal line having a comb shape formed on the same layer as the first metal line such that a plurality of teeth portions of the second metal line are respectively formed between the concave-convex sections at one side of the first metal line; and a third metal line having a comb shape formed on the same layer as the first metal line such that a plurality of teeth portions of the third metal line are respectively formed between the concave-convex sections at the other side of the first metal line.

REFERENCES:
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patent: 6362634 (2002-03-01), Jarvis et al.
patent: 7187179 (2007-03-01), Scaman et al.
patent: 2005/0012556 (2005-01-01), Bhushan et al.
patent: 2005/0023650 (2005-02-01), Forbes

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