Test pads for integrated circuit chips

Details Test pads for integrated circuit chips Test pads for integrated circuit chips

1985-09-27

1988-06-14

Eisenzopf, Reinhard J.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

357 65, G01R 3126

Patent

active

047514582

ABSTRACT:
Integrated circuit chips included on a wafer typically include multiple internal test pads. During diagnostic testing of the wafer, a fine-point test probe is utilized to contact the pads. As feature sizes decrease, the task of consistently and reliably probing very-small-area internal test pads becomes increasingly difficult and time-consuming. In accordance with a feature of the present invention, each internal test pad on a chip is designed to include an interior opening. This provides a continuous interior edge which reliably limits sliding of an inserted tip while ensuring good electrical contact between the tip and the pad being probed.

REFERENCES:
patent: 3617818 (1971-11-01), Fuller
patent: 3974443 (1976-08-01), Thomas
patent: 4063274 (1977-12-01), Dingwall
patent: 4167748 (1979-09-01), D'Angelo
patent: 4242698 (1980-12-01), Ghate et al.
Beldring et al, "Fiber Optic Sensor for Testing and Sorting Semiconductor Devices", Western Electric Technical Digest, No. 33, Jan. 1974, pp. 11-12.

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