Boots – shoes – and leggings
Patent
1995-05-16
1997-02-25
Teska, Kevin J.
Boots, shoes, and leggings
364488, 364489, 364483, G01R 19145, G01R 3128
Patent
active
056065183
ABSTRACT:
A test method and apparatus are provided for predicting hot-carrier induced leakage over time in IGFET's. Test results are used to show how choice of channel length and stress voltages critically affect hot-carrier-induced leakage (HCIL) leakage over time, particularly in devices having submicron channel lengths. Models are developed for predicting leakage current over the long term given short term test results. Alternative design strategies are proposed for reliably satisfying long term leakage requirements.
REFERENCES:
patent: 4382229 (1983-05-01), Cottrell et al.
patent: 4520448 (1985-05-01), Tremintin
patent: 4542340 (1985-09-01), Chakravarti et al.
patent: 4789825 (1988-12-01), Carelli et al.
patent: 4906921 (1990-03-01), Juge
patent: 5012306 (1991-04-01), Tasch, Jr. et al.
patent: 5093275 (1992-03-01), Tasch, Jr. et al.
patent: 5153510 (1992-10-01), Kominsky
patent: 5381345 (1995-01-01), Takegami et al.
Kriese et al., "MOSFET Hot Electron Effect Characterization," IBM Corp., 1976, pp. 2119-2120.
Phillips, Jr. et al., "IGFET Hot Electron Emission Model," 1975 IEDM Digest Paper 3.3, pp. 39-42.
Acovic et al., "Characterization of Hot Electron Stressed MOSFET's by Low Temp. Measurements of the Drain Tunnel Current," IEEE, 1990 pp. 1467-1476.
Fang et al., "Hot Carrier Induced Off State Current Leakage in Submicrometer, PMOSFET Devices," IEEE, 1994, pp. 463-465.
Fang Hao
Fang Peng
Yue John T.
Advanced Micro Devices , Inc.
Phan Thai
Teska Kevin J.
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