Measuring and testing – Testing by imparting motion
Reexamination Certificate
2006-03-28
2006-03-28
Noori, Max (Department: 2855)
Measuring and testing
Testing by imparting motion
Reexamination Certificate
active
07017428
ABSTRACT:
A test kit for a semiconductor package and a method for testing the semiconductor package using the same are provided. The test kit for a semiconductor package includes a pick-and-place tool for picking up and loading/unloading the semiconductor package, a head assembly having a package guider and a socket guider, and a socket which is positioned under the head assembly. The socket guider performs a pre-alignment function for a correct operation of the package guider, before the package guider starts operating. The package guider aligns the semiconductor package.
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English language abstract of Korean Patent Registration No. 10-0273981.
English language abstract of Korean Patent Registration No. 10-0351052.
English language abstract of Japanese Patent Registration No.13-083207.
Bang Jeong-ho
Chae Hyo-geun
Min Byoung-jun
Shim Hyun-seop
Marger & Johnson & McCollom, P.C.
Noori Max
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