Test interconnect for bumped semiconductor components and...

Details Test interconnect for bumped semiconductor components and... Test interconnect for bumped semiconductor components and...

2005-12-27

2005-12-27

Zarncke, David A. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S755090

Reexamination Certificate

active

06980017

ABSTRACT:
An interconnect for testing semiconductor components includes a substrate, and contacts on the substrate for making temporary electrical connections with bumped contacts on the components. Each contact includes a recess and a pattern of leads cantilevered over the recess configured to electrically engage a bumped contact. The leads are adapted to move in a z-direction within the recess to accommodate variations in the height and planarity of the bumped contacts. In addition, the leads can include projections for penetrating the bumped contacts, a non-bonding outer layer for preventing bonding to the bumped contacts, and a curved shape which matches a topography of the bumped contacts. The leads can be formed by forming a patterned metal layer on the substrate, by attaching a polymer substrate with the leads thereon to the substrate, or be etching the substrate to form conductive beams.

REFERENCES:
patent: 4686468 (1987-08-01), Lee et al.
patent: 4766666 (1988-08-01), Sugiyama et al.
patent: 4937653 (1990-06-01), Blonder et al.
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5042148 (1991-08-01), Tada et al.
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5103557 (1992-04-01), Leedy
patent: 5131852 (1992-07-01), Grabbe et al.
patent: 5137461 (1992-08-01), Bindra et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5196726 (1993-03-01), Nishiguchi
patent: 5329423 (1994-07-01), Scholz
patent: 5481205 (1996-01-01), Frye et al.
patent: 5483741 (1996-01-01), Akram et al.
patent: 5500605 (1996-03-01), Chang
patent: 5541525 (1996-07-01), Wood et al.
patent: 5559444 (1996-09-01), Farnworth et al.
patent: 5572140 (1996-11-01), Lim et al.
patent: 5592736 (1997-01-01), Akram et al.
patent: 5607818 (1997-03-01), Akram et al.
patent: 5625298 (1997-04-01), Hirano et al.
patent: 5629837 (1997-05-01), Barabi et al.
patent: 5632631 (1997-05-01), Fjelstad et al.
patent: 5686317 (1997-11-01), Akram et al.
patent: 5691649 (1997-11-01), Farnworth et al.
patent: 5783461 (1998-07-01), Hembree
patent: 5801452 (1998-09-01), Farnworth et al.
patent: 5802699 (1998-09-01), Fjelstad et al.
patent: 5810609 (1998-09-01), Faraci et al.
patent: 5834945 (1998-11-01), Akram et al.
patent: 5900674 (1999-05-01), Wojnarowski et al.
patent: 5931685 (1999-08-01), Hembree et al.
patent: 5936847 (1999-08-01), Kazle
patent: 5962921 (1999-10-01), Farnworth et al.
patent: 5973394 (1999-10-01), Slocum et al.
patent: 6005288 (1999-12-01), Farnworth et al.
patent: 6016060 (2000-01-01), Akram et al.
patent: 6037667 (2000-03-01), Hembree et al.
patent: 6040702 (2000-03-01), Hembree et al.
patent: 6072326 (2000-06-01), Akram et al.
patent: 6086386 (2000-07-01), Fjelstad et al.
patent: 6091252 (2000-07-01), Akram et al.
patent: 6094988 (2000-08-01), Aindow
patent: 6107109 (2000-08-01), Akram et al.
patent: 6114864 (2000-09-01), Soejima et al.
patent: 6188301 (2001-02-01), Kornrumpf et al.
patent: 6200143 (2001-03-01), Haba et al.
patent: 6208156 (2001-03-01), Hembree
patent: 6208157 (2001-03-01), Akram et al.
patent: 6222280 (2001-04-01), Farnworth et al.
patent: 6232243 (2001-05-01), Farnworth et al.
patent: 6242932 (2001-06-01), Hembree
patent: 6242935 (2001-06-01), Akram
patent: 6294837 (2001-09-01), Akram et al.
patent: 6310484 (2001-10-01), Akram et al.
patent: 6313651 (2001-11-01), Hembree et al.
patent: 6314641 (2001-11-01), Akram
patent: 6337577 (2002-01-01), Doherty et al.
patent: 6406774 (2002-06-01), Banba et al.
patent: 6414506 (2002-07-01), Akram et al.
patent: 6437591 (2002-08-01), Farnworth et al.
patent: 6498503 (2002-12-01), Akram et al.
patent: 6529026 (2003-03-01), Farnworth et al.
patent: 08050146 (1996-02-01), None
“Technical Report, Shin-Etsu Inter Connector, MT-Type,” Shin-Etsu Polymer America, Inc., No. MT-Type US, pp. 1-4, and title page, Aug. 5, 1998.
Information Displayed at Chip Con 1997-1998, 4 sheets, on FE CRD Floating Point Technology, (month unavailable).

Affiliated with

Also associated with

Rating

Test interconnect for bumped semiconductor components and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Test interconnect for bumped semiconductor components and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Test interconnect for bumped semiconductor components and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3519665