Test head for IC tester

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Patent

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Details

324537, G01R 3126, H01L 2166

Patent

active

059364173

ABSTRACT:
To provide a test head for an IC tester wherein identical test signals can be distributed to a plurality of devices to be tested while holding in check an increase in the number of signal lines connecting a waveform shaper to the test head, upsizing of the test head, and an increase in power consumption. A plurality of pin-electronics-cards are connected with each other via a printed wiring pattern on a back board provided inside a test head, a waveform signal shaped at a waveform shaper is received by a receiver card provided in the test head and the waveform signal delivered from the receiver card is distributed to the plurality of the pin-electronics-cards via the printed wiring pattern provided on the back board while the end of the printed wiring pattern is terminated at the termination card.

REFERENCES:
patent: 4517512 (1985-05-01), Petrich et al.
patent: 4862075 (1989-08-01), Choi et al.
patent: 5101153 (1992-03-01), Morong, III
patent: 5216361 (1993-06-01), Akar et al.
patent: 5635846 (1997-06-01), Beaman et al.

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