Test head assembly having paired contact structures

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C324S756010, C324S757020

Reexamination Certificate

active

11119715

ABSTRACT:
A test head assembly can include a probe card, which can include first contact areas. The test head assembly can also include a contactor, which can include second contact areas. An interposer can include first spring contact structures and second spring contact structures. The first spring contact structures can contact one of the first contact areas, and the second spring contact structures can contact one of the second contact areas. Ones of the first spring contact structures can be electrically connected through the interposer to ones of the second spring contact structures. One of the first spring contact structures can include a pair of contacts, both of which can extend from a first surface of the interposer to contact one of the first contact areas. Alternatively or additionally, one of the second spring contact structures can include a pair of contacts, both of which can extend form a second surface of the interposer to contact one of the second contact areas.

REFERENCES:
patent: 3173737 (1965-03-01), Kinkaid et al.
patent: 3519890 (1970-07-01), Ashby
patent: 3842189 (1974-10-01), Southgate
patent: 4553192 (1985-11-01), Babuka et al.
patent: 4615573 (1986-10-01), White et al.
patent: 4772228 (1988-09-01), Seymour
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: H842 (1990-11-01), Ochs
patent: 5014161 (1991-05-01), Lee et al.
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5228861 (1993-07-01), Grabbe
patent: 5286208 (1994-02-01), Matsuoka
patent: 5462440 (1995-10-01), Rothenberger
patent: 5513430 (1996-05-01), Yanof et al.
patent: 5534784 (1996-07-01), Lum et al.
patent: 5555422 (1996-09-01), Nakano
patent: 5576630 (1996-11-01), Fujita
patent: 5599194 (1997-02-01), Ozawa et al.
patent: 5613861 (1997-03-01), Smith et al.
patent: 5632631 (1997-05-01), Fjelstad et al.
patent: 5666190 (1997-09-01), Quate et al.
patent: 5701085 (1997-12-01), Malladi et al.
patent: 5810609 (1998-09-01), Faraci et al.
patent: 5821763 (1998-10-01), Beaman et al.
patent: 5829128 (1998-11-01), Eldridge et al.
patent: 5914614 (1999-06-01), Beaman et al.
patent: 5944537 (1999-08-01), Smith et al.
patent: 5953214 (1999-09-01), Dranchak et al.
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 5994152 (1999-11-01), Khandros et al.
patent: 6014032 (2000-01-01), Maddix et al.
patent: 6016061 (2000-01-01), Mizuta
patent: 6029344 (2000-02-01), Khandros et al.
patent: 6031282 (2000-02-01), Jones et al.
patent: 6059982 (2000-05-01), Palagonia et al.
patent: 6064213 (2000-05-01), Khandros et al.
patent: 6072190 (2000-06-01), Watanabe et al.
patent: 6183267 (2001-02-01), Marcus et al.
patent: 6184053 (2001-02-01), Eldridge et al.
patent: 6184576 (2001-02-01), Jones et al.
patent: 6214631 (2001-04-01), Burrows et al.
patent: 6255126 (2001-07-01), Mathieu et al.
patent: 6255727 (2001-07-01), Khoury
patent: 6289583 (2001-09-01), Belmont et al.
patent: 6307392 (2001-10-01), Soejima et al.
patent: 6344752 (2002-02-01), Hagihara et al.
patent: 6359455 (2002-03-01), Takekoshi
patent: 6452407 (2002-09-01), Khoury et al.
patent: 6713374 (2004-03-01), Eldridge et al.
patent: 6780001 (2004-08-01), Eldridge et al.
patent: 6888362 (2005-05-01), Eldridge et al.
patent: 2001/0012739 (2001-08-01), Grube et al.
patent: 2001/0044225 (2001-11-01), Eldridge et al.
patent: 2002/0171133 (2002-11-01), Mok et al.
patent: 2003/0099737 (2003-05-01), Eldridge et al.
patent: 2005/0016251 (2005-01-01), Eldridge et al.
patent: 632281 (1995-01-01), None
patent: 899538 (1999-03-01), None
patent: 58-191453 (1983-11-01), None
patent: 05-18741 (1993-01-01), None
patent: 05-198716 (1993-08-01), None
patent: 06-267408 (1994-09-01), None
patent: 07-21968 (1995-01-01), None
patent: 07-333232 (1995-12-01), None
patent: 08-306708 (1996-11-01), None
patent: 341747 (1998-10-01), None
patent: WO 91/12706 (1991-08-01), None
patent: WO 96/15458 (1996-05-01), None
patent: WO 96/16440 (1996-05-01), None
patent: WO 96/37332 (1996-11-01), None
patent: WO 97/44676 (1997-11-01), None
patent: WO 98/21597 (1998-05-01), None
patent: WO 98/52224 (1998-11-01), None
patent: WO 99/38229 (1999-07-01), None
patent: WO 00/33089 (2000-06-01), None
patent: WO 00/33096 (2000-06-01), None
patent: WO 01/09952 (2001-02-01), None
U.S. Appl. No. 09/364,788, filed Jul. 30, 1999, Eldridge et al.
U.S. Appl. No. 09/364,855, filed Jul. 30, 1999, Eldridge et al.
U.S. Appl. No. 09/710,539, filed Nov. 9, 2000, Eldridge et al.
“A New Wafer Probe Interface Technology Using Compliant Microsprings, A Joint Study by Teradune, Inc. and FormFactor, Inc.,” Teradyne Formfactor White Paper (Jan. 30, 1998), pp. 1-18.
Novitsky et al., “FormFactor Introduces An Integrated Process For Wafer-Level Packaging, Burn-in Testing, And Module Level Assembly” (FormFactor Mar. 1999), 6 pages.
Khandros et al., “New Methods For Reducing Costs In Semiconductor Back-End,” (FormFactor Jan. 30, 1998), 9 pages.

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