Test handler, method for loading and manufacturing packaged...

Details Test handler, method for loading and manufacturing packaged... Test handler, method for loading and manufacturing packaged...

2011-01-25

2011-01-25

Nguyen, Ha Tran T (Department: 2829)

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

C324S765010

Reexamination Certificate

active

07876089

ABSTRACT:
A test handler, a packaged chip loading method, a test tray transferring method, and a packaged chip manufacturing method are provided. The test handler may include a loading unit, a chamber system, an unloading unit, at least one rotating unit and a transferring unit. The loading unit may include a loading buffer disposed to be movable along a moving path formed over a loading position and a loading picker to perform a loading process on the test tray located at the loading position. The chamber system having the packaged chips connected to a hi-fix board and tested. The unloading unit may include an unloading picker to perform an unloading process on the test tray located at an unloading position. The at least one rotating unit may be disposed between the loading unit and the unloading unit to rotate the test tray transferred from the loading unit from a horizontal posture to a vertical posture, and to rotate the test tray transferred from the chamber system from a vertical posture to a horizontal posture. The transferring unit may transfer the test tray.

REFERENCES:
patent: 7023197 (2006-04-01), Jung
patent: 7196508 (2007-03-01), Ham et al.
patent: 2003/0177633 (2003-09-01), Haji et al.
patent: 2005/0168214 (2005-08-01), Kim
patent: 2006/0214655 (2006-09-01), Ham et al.
patent: 10-1999-0082838 (1999-11-01), None
patent: 10-0560729 (2006-03-01), None
Korean Office Action dated Sep. 28, 2009.

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