Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1994-03-25
1995-10-10
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257276, 257522, 257669, 257778, 257785, H01L 2904
Patent
active
054573440
ABSTRACT:
A two-level metal connector having only one via level accommodates motion due to thermal expansion and manufacturing tolerances by decoupling vertical and lateral freedom of motions. The lateral motion from thermal expansion is small but strong, whereas the vertical motion is much larger because the connection must accommodate manufacturing tolerances of the solder bumps over the area of the die. By separating the horizontal and vertical displacements through a laterally-free anchor and flexible bridge, the height of the anchor may be made quite shallow while maintaining a comparatively large vertical distance for a probe tip to travel. Since the substrate is merely for structural support, the two-level metal connector can be placed over any substrate including one that already has many layers of metal.
REFERENCES:
patent: 4615573 (1986-10-01), White et al.
patent: 4949148 (1990-08-01), Bartelink
patent: 5086337 (1992-02-01), Noro et al.
patent: 5189505 (1993-02-01), Bartelink
patent: 5250847 (1993-10-01), Baskett
Limanek Robert P.
Tremblay Mark S.
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