Test circuit and multi-chip package type semiconductor...

Details Test circuit and multi-chip package type semiconductor... Test circuit and multi-chip package type semiconductor...

2005-05-24

2005-05-24

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S048000, C257S693000, C324S713000

Reexamination Certificate

active

06897554

ABSTRACT:
A MCP semiconductor device includes at least first and second chips, each of which has internal pads and an internal circuit, encapsulated by a sealing material together. The device further includes a test circuit. The test circuit connects each of the internal pads to one of the internal circuits under a normal operation mode of the device, and disconnect between them under a test mode.

REFERENCES:
patent: 5908304 (1999-06-01), Oudart et al.
patent: 6195774 (2001-02-01), Jacobson
patent: 6205082 (2001-03-01), Tomita et al.
patent: 6216240 (2001-04-01), Won et al.
patent: 03-279880 (1991-12-01), None
patent: 04-250644 (1992-09-01), None
patent: 05-341014 (1993-12-01), None

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