Test board for testing semiconductor device

Details Test board for testing semiconductor device Test board for testing semiconductor device

2002-10-31

2004-04-20

Pert, Evan (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

06724213

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a test board for testing semiconductor devices by connecting a semiconductor testing apparatus and a semiconductor device in the test.
2. Background Art
A structure of a conventional multi-layer wiring board test jig/tool is shown in FIG.
9
. In the multi-layer wiring board test jig/tool, output signals from the pogo pin of the test head
105
of the tester (semiconductor testing apparatus) are inputted to DUTs (devices under test)
120
through a multi-layer wiring board (mother board)
104
, a relaying multi-layer wiring board (I/F board)
103
, and contact sockets
102
. The relaying multi-layer wiring board
103
and the contact sockets
102
correspond to the package form of the DUTs
120
and the pin locations of the DUTs
120
, and they are connected with cable wirings. The test signals are transmitted from the test head
105
to a DUT
120
on a line tray
101
, and the predetermined test is conducted.
However, the capacity of the tester limits the number of DUTs
120
that can be tested at a time, and the type of the DUT varies the number. Therefore, the specifications of the multi-layer wiring board test jig/tool becomes different depending on parameters such as the package form of the DUTs
120
, the pin locations of the DUTs
120
, and the conveying pattern of the DUTs
120
.
In order to accommodate such various tests, in a conventional multi-layer wiring board test jig/tool as shown in
FIG. 9
, wiring using coaxial cables
106
was unavoidable in the connection of the multi-layer wiring board
104
with the relaying multi-layer wiring board (I/F board)
103
due to the structure of such a test jig/tool. Wiring was changed using the coaxial cables
106
corresponding to the specifications of DUTs
120
. In this case, several tens of coaxial cables
106
were required for one DUT
120
(IC), and for example, when 30 DUTs
120
were to be tested at a time, wiring using coaxial cables
106
became very complicated, and there arose the problems of the complication of the wire-connecting process and the deterioration of wiring reliability and electrical properties.
Also in conventional testing methods, since a single IC as a DUT
120
had to be placed on a line tray
101
, a problem of the deterioration of measurement efficiency and the complication of the testing process arose. Furthermore, the operation to transfer the IC on the line tray
101
to another tray was required.
SUMMARY OF THE INVENTION
The present invention was devised to solve the above-described problems, and the object of the present invention is to provide improved reliability of the connection between the DUT and the tester, and improved electrical properties, as well as the simplified test process and the improved measurement efficiency.
According to one aspect of the present invention, a test board for testing semiconductor devices by connecting a plurality of semiconductor devices under the test with a semiconductor test apparatus is provided. The test board sends test signals from the semiconductor test apparatus to the plurality of semiconductor devices under the test. The test board comprises a first wiring board, a second wiring board, and a third wiring board. The first wiring board is disposed on the semiconductor test apparatus, and connected to the semiconductor test apparatus. The second wiring board is connected to each of the plurality of semiconductor devices under the test through contact portions. The third wiring board is disposed between the first wiring board and the second wiring board. The first wiring board and the third wiring board, and the second wiring board and the third wiring board are each connected by connectors.
Since connections between the first wiring board and the third wiring board, and between the second wiring board and the third wiring board, are carried out by connectors, the connection between each wiring boards can be made wiring-less, and no wiring materials, such as coaxial cables, are required. Therefore, erroneous connections in assembling can be eliminated, and complicated wiring connection processes become unnecessary. Since the degradation of wiring materials caused by change thereof due to aging can be prevented, and high reliability can be maintained.
Other and further objects, features and advantages of the invention will appear more fully from the following description.


REFERENCES:
patent: 5896037 (1999-04-01), Kudla et al.
patent: 6069482 (2000-05-01), Hilton
patent: 6078186 (2000-06-01), Hembree et al.
patent: 6104202 (2000-08-01), Slocum et al.
patent: 6356098 (2002-03-01), Akram et al.
patent: 8-201476 (1996-08-01), None

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