Test board for testing a semiconductor device, method of testing

Details Test board for testing a semiconductor device, method of testing Test board for testing a semiconductor device, method of testing

1996-03-08

1998-11-03

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324757, 324765, G01R 3102

Patent

active

058314415

ABSTRACT:
A test board used for testing a semiconductor device provided with projection electrodes includes a main board and testing electrodes. The testing electrodes are provided on the main board, each projecting upwardly from the main board. When the semiconductor device is tested, the testing electrodes are electrically connected to the projection electrodes by insertion of the testing electrodes into the projection electrodes. The semiconductor device is mounted on the main board to test the semiconductor device through the testing electrodes.

REFERENCES:
patent: 5326428 (1994-07-01), Farnworth et al.
patent: 5374893 (1994-12-01), Koopman et al.
patent: 5604445 (1997-02-01), Desai et al.
patent: 5634267 (1997-06-01), Farnworth et al.
Yuichi Nakamura, "Bare-chip burn-in test system," Electronics fabricating technology in Japanese, vol.11 No.4, pp.27-31, (1995) (month unavailable).
Randal Reebuck, et al., "Performance Testing of a Non-Destructive Burn-In Interconnect system for Known Good Die, DieMate," Texas Instruments Technical Library, 1994 (Oct.).

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