Test board for high-frequency system level test

Details Test board for high-frequency system level test Test board for high-frequency system level test

2007-06-19

2007-06-19

Nguyen, Ha Tran (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S758010, C324S761010, C324S1540PB

Reexamination Certificate

active

11025093

ABSTRACT:
A test board for a high-frequency system level test: The test board includes a main board having through holes filled with a conductive material. These holes may be located at a portion of the main board from which an existing module socket has been removed. An interface board has surface mounted device (SMD) pads on front and rear surfaces. The SMD pads on the front surface of the interface board are connected with the SMD pads on the rear surface thereof through cross connection wiring within the interface board for a pin swap. The through holes of the main board are connected with the SMD pads on the rear surface of the interface board via iron cores fixed at a guide. A test module socket is mounted on surfaces of the SMD pads on the front surface of the interface board.

REFERENCES:
patent: 5136238 (1992-08-01), Kade
patent: 6191597 (2001-02-01), Driller et al.
patent: 11-186700 (1999-09-01), None
English language abstract of Korean Publication No. 1999-81438.
English language abstract of Korean Publication No. 2003-64024.
English language abstract of Korean Publication No. 2003-0064024.
English language abstract of Korean Publication No. 2001-0018822.
English language abstract of Japanese Publication No. 5-256904.

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