Test apparatus having pogo probes for chip scale package

Details Test apparatus having pogo probes for chip scale package Test apparatus having pogo probes for chip scale package

2008-07-09

2010-06-15

Nguyen, Vinh P (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090, C324S761010

Reexamination Certificate

active

07737711

ABSTRACT:
A pogo-type probe to be installed in a probe socket and a probe card for testing chip scale package of a semiconductor device is characterized in that the pogo probe has a hollow main body for receiving at least one resilient element internally and the main body comprises two end portions disposed with a first probe head and a second probe head respectively, wherein each of the probe heads is composed of a plurality of taper members to form a crown shape, and each of the taper members has an individual chamfer so that each chamfer has a tip to contact each contact pad of the semiconductor device under test for chip scale package.

REFERENCES:
patent: 4560223 (1985-12-01), Cooney et al.
patent: 6046597 (2000-04-01), Barabi
patent: 6208155 (2001-03-01), Barabi et al.
patent: 6220870 (2001-04-01), Barabi et al.
patent: 6464511 (2002-10-01), Watanabe et al.
patent: 6677772 (2004-01-01), Faull
patent: 6685492 (2004-02-01), Winter et al.

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