Test apparatus having intermediate connection board for package

Details Test apparatus having intermediate connection board for package Test apparatus having intermediate connection board for package

2006-11-07

2006-11-07

Patel, Tulsidas C. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S071000

Reexamination Certificate

active

07131847

ABSTRACT:
A test apparatus may include a test socket having socket pins with a standard configuration. An intermediate connection board may be interposed between the test socket and a package that has solder balls with a non-standard configuration. The intermediate connection board may have contact balls and contact pads. The contact balls may be arranged in a configuration that is compatible with the standard socket pin configuration, and the contact pads may be arranged in a configuration that is compatible with the non-standard solder ball configuration.

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Korean Office Action dated Nov. 30, 2005.

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