Test apparatus for integrated circuit die

Details Test apparatus for integrated circuit die Test apparatus for integrated circuit die

1993-11-26

1995-10-03

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324762, G01R 3102

Patent

active

054555183

ABSTRACT:
An integrated circuit testing system for testing small quantities of integrated circuit die. The testing system includes an integrated circuit tester and a base printed wiring board interface that physically and electrically interfaces thereto. A die holder that holds an integrated circuit die is coupled to the base printed wiring board interface. A flexprint structure including first and second flexible contact structures is provided that electrically connect to the base printed wiring board interface, to pads on the integrated circuit die, and to each other to provide for electrical connection between the tester and the die. A plurality of alignment pins are provided for aligning the first and second flexible contact structures to each other and to the pads on the integrated circuit die. The present system is specifically designed for testing low quantities of small and large die, such as application specific integrated circuits (ASIC), without attaching the die to a substrate and wire bonding it for test purposes. The testing system is versatile in that it can test a variety of pad patterns on the die. The system is relatively low cost and has a low cost per operation. Furthermore, the system provides for high test accuracy and good quality contact to the die.

REFERENCES:
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4956605 (1990-09-01), Bickford et al.
patent: 5156983 (1992-10-01), Schleringer et al.

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