Test apparatus for electrical circuit boards

Geometrical instruments

Patent

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339 17CF, H01R 900

Patent

active

044602367

ABSTRACT:
Test apparatus for testing the circuits carried by an electrical circuit board (11) through receptacles (10) for mounting electrical components such as dual inline circuit packs (DIPs) (20). The two rows of contacts (16) for receiving the terminals (19) of a DIP of a receptacle (10) are modified to extend over the top of the housing of the receptacle and downward along its sides (13, 14) to present electrical contact surfaces (21). A test plug (22) is provided which has two rows of test terminals (23) extending from an upper surface. The test terminals (23) extend through the body of the plug (22) to terminate in curved contact surfaces (25) corresponding to the contact surfaces (21) on the sides (13, 14) of the receptacle housing. A pair of skirts (26, 27) extend from the sides of the body of the plug (22) outwardly of the terminal contact surfaces (25). The test plug (22) is fitted over a receptacle so that its contact surfaces (25) make frictional contact with the receptacle contact surfaces (21) when the ends of the plug skirts (26, 27) come to rest on the circuit board (11) face. The circuits on the board (11) may thus be tested by means of the plug (22) test terminals (23) without risk of damage to the fragile contacts (16) of a receptacle (10). The width of the skirts (26, 27) is determined so that the testing may be accomplished whether or not a DIP is mounted in the receptacle.

REFERENCES:
patent: 1718529 (1929-06-01), Coldwell
patent: 2074397 (1937-03-01), Israel
patent: 3262082 (1966-07-01), Gammel, Sr.
patent: 3264601 (1966-08-01), Hartholz
patent: 3409860 (1968-11-01), Kirby
patent: 3605075 (1971-09-01), Stofkooper
patent: 3656183 (1972-04-01), Walterscheid
patent: 4060296 (1977-11-01), Kunkle et al.
patent: 4113337 (1978-09-01), McKee
patent: 4322119 (1982-03-01), Baker
patent: 4390224 (1983-06-01), Showman et al.
IBM Bulletin, vol. 13, No. 7, Dec. 1970, "Microcircuit Module and Connector", by Franck and Hill.

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