Test analysis apparatus and analysis method for semiconductor wa

Details Test analysis apparatus and analysis method for semiconductor wa Test analysis apparatus and analysis method for semiconductor wa

1994-06-23

1996-02-20

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, 324501, 324750, G01R 3100

Patent

active

054932360

ABSTRACT:
A test analysis apparatus for OBIC analysis and luminous analysis from a rear surface of a semiconductor wafer. According to the present invention, a semiconductor wafer is mounted on a wafer chuck and a probe card which has metallic needles and which is movable along the X, Y, and Z axes supplies a test pulse signal to respective electrode pads on the front surface of the semiconductor wafer. Then, current generated in the semiconductor wafer is detected at the electrode pads. Optical analysis, such as irradiation with a light beam, detection of reflected light, detection of light generated in the semiconductor wafer and the like, is performed from the rear side of the semiconductor wafer, thereby enabling analysis of a failure or a defect of a defective portion while the semiconductor wafer is in actual operating conditions.

REFERENCES:
patent: 4761607 (1988-08-01), Shiragasawa et al.
patent: 4864227 (1989-09-01), Sato
patent: 5334540 (1994-08-01), Ishii
patent: 5365034 (1994-11-01), Kawamura et al.
patent: 5394098 (1995-02-01), Meyrueix et al.
Henley, "Logic Failure Analysis Of CMOS VLSI Using A Laser Probe", IEEE/IRPS, 1984, pp. 69-75.
Tsutsu et al, "Life Time Evaluation Of MOSFET In ULSIs Using Photon Emission Method", Proceedings of IEEE 1992 International Conference on Microelectronic Test Structures, vol. 5, 1992, pp. 94-99.
Inuzuka et al, "Emission Analysis Of Semiconductor Devices From Backside Of The Chip", 3rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, 1992.

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