Ternary barrier structure for conductive electrodes

Details Ternary barrier structure for conductive electrodes Ternary barrier structure for conductive electrodes

1974-12-23

1977-04-12

Wojciechowicz, Edward J.

357 68, 357 71, H01L 2348, H01L 2944, H01L 2946

Patent

active

040178897

ABSTRACT:
A ternary barrier structure and method for forming the structure to be used on a conductive electrode. In electronic structures, dielectric substrates are used which have a plurality of connecting conductive areas which are wettable by solder. The region surrounding these connecting conductive areas are not wettable by solder. Barrier structures are used to prevent the flow of the solder while the solder is liquid during the manufacture of these electronic products. The present barrier structure covers at least a portion of one of these connecting conductive electrodes wherein the electrode is composed predominantly of silver and a lesser quantity of one or more of the platinum metals. The barrier structure includes a gold bearing, non-wettable by solder, glaseous layer over a portion of the electrode. The portion of the conductive electrode under and adjacent to the barrier glasseous layer contains a gold-silver alloy which is produced during the formation of the barrier structure by diffusion of the gold from the glasseous layer into the conductive electrode. A particularly corrosion resistant barrier structure and conductive electrode combination is thereby produced at this rather critical point in the microminiature circuit structure.

REFERENCES:
patent: 3597665 (1971-08-01), Quetsch et al.
patent: 3809625 (1974-05-01), Brown et al.

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