Terminals of surface mount components

Details Terminals of surface mount components Terminals of surface mount components

1992-07-01

1993-08-31

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

29843, 29854, 29860, 174259, 174260, 22818021, 439884, 361772, 361773, H01R 402

Patent

active

052411346

ABSTRACT:
The prior art terminal for making a solder bond between a lead and a bond site is modified so as to enhance the reliability of the solder bond. In one embodiment, this modification entails solder relief terminals: solder relief holes through the terminal, notches, grooves or ridges on the surface of the terminal, or bending of the terminal. In a second embodiment, this modification entails predeposit of a predetermined and controlled amount of solid solder and flux on the terminal.

REFERENCES:
patent: 4064356 (1977-12-01), Marler, Jr. et al.
patent: 4396140 (1983-08-01), Jaffe et al.
patent: 4607782 (1986-08-01), Mims
patent: 4657172 (1987-04-01), Lee
patent: 4722470 (1988-02-01), Johary
patent: 4777564 (1988-10-01), Derfiny
patent: 4818823 (1989-04-01), Bradley
patent: 4907991 (1990-03-01), Kobayashi
patent: 4949223 (1990-08-01), Achiwa
patent: 4959590 (1990-09-01), Hatada et al.
patent: 4991666 (1991-02-01), Septfons et al.
patent: 5012388 (1991-04-01), Kabeshita et al.
Ad, Circuits Manufacturing, Feb., 1990 for NAS Electronics (copy enclosed).

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