Terminals for a resin-sealed semiconductor device

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

257693, 429170, H01L 2328

Patent

active

053731050

ABSTRACT:
A terminal structure for a resin-sealed semiconductor device is formed of a circuit assembly, an outer casing for housing the circuit assembly therein and having a recess for retaining a terminal nut therein, molding resin filled in the outer casing to seal the circuit assembly, and an externally drawn terminal connected to the circuit assembly and extending outwardly through the outer casing. The externally drawn terminal has an external wire connecting portion disposed outside the lid. An anchor or a fixing device is attached to the external wire connecting portion so that the external wire connecting portion is fixed to the casing by two points.

REFERENCES:
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patent: 3648337 (1972-03-01), Greskamp et al.
patent: 3711752 (1973-01-01), Nier
patent: 4172272 (1979-10-01), Schneider
patent: 4443655 (1984-04-01), Van Dyk Soerewyn
patent: 4538168 (1985-08-01), Van Dyk Soerewyn
patent: 4694322 (1987-09-01), Sakurai et al.
patent: 4876677 (1989-10-01), Moriya
patent: 5090919 (1992-02-01), Tsuji
patent: 5155660 (1992-10-01), Yamada et al.
patent: 5281493 (1994-01-01), Jones

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