Terminal pad for fixing a clawed pin to the edge of a hybrid cir

Details Terminal pad for fixing a clawed pin to the edge of a hybrid cir Terminal pad for fixing a clawed pin to the edge of a hybrid cir

1988-12-22

1991-02-12

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174267, 361406, 439 79, 439 81, H05K 100

Patent

active

049916661

ABSTRACT:
The edge terminal pad is intended to receive a connection pin (30). It has two tinnable area solder blobs (17, 18) placed overlying each other on opposite faces of a margin of a substrate (10) at locations which are grasped by the claws (33, 34, 35) of the pin (30), with said claws forming the jaws of a resilient clamp. The tinnable area solder blob (17, 18) are notched by grooves (19, 20) at the locations of slide paths followed by the claws (33, 34, 35) while the pin (30) is being put into place. For a pin (30) having three claws with the combined width of all three claws being the same as the width of a terminal pad, one of the pad's tinnable area solder blobs (17) is generally U-shaped, while the other (18) is generally T-shaped. The advantage of the grooves is to restrict the amounts by which the clamp of the pin needs to open and to automatically center the pin on the pad, providing the pin is put into place after the tinnable areas (17, 18) have already been tinned.

REFERENCES:
patent: 3381081 (1968-04-01), Schalliol
patent: 3536821 (1970-10-01), Doering, Jr.
patent: 3689684 (1972-09-01), Cox, Jr. et al.
patent: 4037898 (1977-07-01), Guyette
patent: 4091529 (1978-05-01), Zaleckas
patent: 4464832 (1984-08-01), Asick et al.
patent: 4502745 (1985-03-01), Chavers et al.
patent: 4737115 (1988-04-01), Seidler
32nd Electronic Components Conference, May 10-12, 1982, San Diego, Calif., pp. 346-353, IEEE; H. N. Keller, "Significant Features of Solder Connections to Gold-Plated Thin Films".
Solid State Technology, vol. 25, No. 10, Oct. 1982, pp. 99-104, Port Washington, N.Y., E. A. Gutbier, et al., "More Reliable Connections to Condensation-Soldered Terminals".

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