Terminal electrode forming apparatus and system for holding...

Details Terminal electrode forming apparatus and system for holding... Terminal electrode forming apparatus and system for holding...

2005-07-19

2009-02-10

Osele, Mark A (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

C156S247000, C156S249000, C156S345420, C156S541000, C156S583200, C118S642000, C118S423000, C118S067000, C118S068000

Reexamination Certificate

active

07487815

ABSTRACT:
The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.

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