Terminal connections on microcircuit chips

Details Terminal connections on microcircuit chips Terminal connections on microcircuit chips

1978-04-12

1979-01-16

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 16, C25D 502, C25D 548

Patent

active

041348010

ABSTRACT:
A method of manufacturing an elementary slice provided with a microcircuit and having terminal connections in the form of metallic bumps which ensure the connection of the microcircuit to external circuitry. A major slice is provided in which a number of elementary slices are formed which adjoin each other along future severing lines. Lands are provided on which to grow metallic bumps. In order to be able to electrolytically grow the metallic bumps on the lands, the latter are series-connected together and to a voltage source by conductive strips which extend in a zig-zag manner over the severing lines. After the growth process the electric connections between the lands are automatically interrupted when the slice is severed into elementary slices. The most important application of the invention lies in the field of manufacturing elementary slices with bubble domain handling structures.

REFERENCES:
patent: 3821847 (1974-07-01), Melse et al.
patent: 3926746 (1975-12-01), Hargis

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