Terahertz interconnect system and applications

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

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Details

C257S030000

Reexamination Certificate

active

06967347

ABSTRACT:
An assembly includes a first electrical circuitry for providing a first electrical signal containing data and a transmitting arrangement, connected with the first electrical circuitry, for receiving the first electrical signal and for converting the first electrical signal into an electromagnetic signal containing at least a portion of the data. The electromagnetic signal has a carrier frequency greater than 300 GHz. The assembly also includes a receiving arrangement for receiving the electromagnetic signal and for converting the electromagnetic signal into a second electrical signal containing at least some of the portion of the data, and a second electrical circuitry connected with the receiving arrangement and configured for receiving the second electrical signal.

REFERENCES:
patent: 5056111 (1991-10-01), Duling et al.
patent: 5093692 (1992-03-01), Su et al.
patent: 5287212 (1994-02-01), Cox et al.
patent: 5754948 (1998-05-01), Metze
patent: 5825240 (1998-10-01), Geis et al.
patent: 5895934 (1999-04-01), Harvey et al.
patent: 6049308 (2000-04-01), Hietala et al.
patent: 6664562 (2003-12-01), Weiss et al.

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