Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1997-10-14
2000-07-25
Karlsen, Ernest
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324765, G01R 1073, G01R 3128
Patent
active
060940581
ABSTRACT:
A temporary package for a semiconductor die is provided. The temporary package has an outline and external contact configuration that are the same as a conventional plastic or ceramic semiconductor package. The temporary package can be used for burn-in testing of the die using standard equipment. The die can then be removed from the package and certified as a known good die. The package includes a base, an interconnect and a force applying mechanism. The package base includes external contacts formed in a dense array, such as a land grid array (LGA), a pin grid array (PGA), a bumped grid array (BGA) or a perimeter array. The package base can be formed of ceramic or plastic with internal conductive lines using a ceramic lamination process, a 3-D molding process or a Cerdip formation process.
REFERENCES:
patent: 4169642 (1979-10-01), Mouissie
patent: 4597617 (1986-07-01), Enochs
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4899921 (1990-02-01), Bendat et al.
patent: 4937653 (1990-06-01), Blonder et al.
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5081563 (1992-01-01), Feng et al.
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5281151 (1994-01-01), Arima et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5367253 (1994-11-01), Wood et al.
patent: 5397245 (1995-03-01), Roebuck et al.
patent: 5408190 (1995-04-01), Wood et al.
patent: 5419807 (1995-05-01), Akram et al.
patent: 5451165 (1995-09-01), Cearley-Cabbiness et al.
patent: 5456404 (1995-10-01), Robinette, Jr. et al.
patent: 5471151 (1995-11-01), DiFrancesco
patent: 5543725 (1996-08-01), Lim et al.
patent: 5634267 (1997-06-01), Farnworth
patent: 5656945 (1997-08-01), Cain
patent: 5691649 (1997-11-01), Farnworth et al.
patent: 5739050 (1998-04-01), Farnworth
patent: 5783461 (1998-07-01), Hembree
patent: 5796264 (1998-08-01), Farnworth et al.
patent: 5815000 (1998-09-01), Farnworth et al.
patent: 5834945 (1998-11-01), Akram et al.
patent: 5844418 (1998-12-01), Wood et al.
patent: 5878485 (1999-03-01), Wood et al.
patent: 5896036 (1998-04-01), Wood et al.
patent: 5929647 (1999-07-01), Akram et al.
patent: 5949242 (1999-09-01), Wood et al.
patent: 5982185 (1999-11-01), Farnworth
Akram Salman
Farnworth Warren M
Hembree David R.
Wood Alan G.
Gratton Stephen A.
Karlsen Ernest
Micro)n Technology, Inc.
LandOfFree
Temporary semiconductor package having dense array external cont does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Temporary semiconductor package having dense array external cont, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Temporary semiconductor package having dense array external cont will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1339053