Temporary package for semiconductor dice

Details Temporary package for semiconductor dice Temporary package for semiconductor dice

1997-04-25

1998-06-02

Tung, M. H.

Equipment for production, distribution, or transformation of ene

Distribution, modification or control

Semiconductor, transistor or integrated circuit

1303

Patent

active

D03948447

REFERENCES:
patent: D317592 (1991-06-01), Yoshizawa
patent: D359028 (1995-06-01), Siegel et al.
patent: 5053853 (1991-10-01), Haj-Ali-Ahmadi et al.
patent: 5155067 (1992-10-01), Wood et al.
patent: 5173451 (1992-12-01), Kinsman et al.
patent: 5206536 (1993-04-01), Lim
patent: 5302891 (1994-04-01), Wood et al.
patent: 5408190 (1995-04-01), Wood et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5442232 (1995-08-01), Goto et al.
patent: 5451165 (1995-09-01), Cearley-Cabbiness et al.
patent: 5455452 (1995-10-01), Kiyono
patent: 5471088 (1995-11-01), Song
patent: 5495179 (1996-02-01), Wood et al.
patent: 5517125 (1996-05-01), Posedel et al.
patent: 5519332 (1996-05-01), Wood et al.
patent: 5530376 (1996-06-01), Lim et al.
patent: 5541525 (1996-07-01), Wood et al.
patent: 5543725 (1996-08-01), Lim et al.
patent: 5581195 (1996-12-01), Lee et al.
1994 Dram Data Book, Micron Semiconductor, Inc., pp. 7-7-7-13, Apr., 1994.

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