Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1997-03-03
2000-06-06
Brown, Glenn W.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324757, 324765, G01R 3126
Patent
active
060723238
ABSTRACT:
A temporary package, a method, and a system for testing a semiconductor die having a backside electrode are provided. The temporary package includes a base for retaining the die; a conductive member for electrically contacting the backside electrode on the die; and terminal contacts in electrical communication with the conductive member. The package also includes a force applying mechanism for biasing the conductive member against the backside electrode. A conductive path between the conductive member and terminal contacts can be through a wire, or through the force applying mechanism. In an alternate embodiment the temporary package includes a base and terminal contacts formed in the configuration of a conventional semiconductor package. A cover for the base can include a metal, carbon filled elastomer, conductive foam, or conductive adhesive conductive member. The conductive member can be adapted to simultaneously contact the backside electrode on the die, and a mating contact on the base in electrical communication with the terminal contact. In addition, the conductive member can function as a heat sink for cooling the die during the test procedures.
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Akram Salman
Farnworth Warren M.
Hembree David R.
Wark James M.
Brown Glenn W.
Gratton Stephen A.
Micro)n Technology, Inc.
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