Temporary connections for fast electrical access to electronic d

Details Temporary connections for fast electrical access to electronic d Temporary connections for fast electrical access to electronic d

1994-11-23

1996-01-02

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

257739, G01R 106, H01L 2348

Patent

active

054812054

ABSTRACT:
A given testing substrate for fast-testing many integrated-circuit electronic devices, one after the other, has a set of mutually insulated collated wiring areas that can be aligned with solder-bump I/O pads of the electronic devices. At the surface of each of the corrugated areas is located a layer that is an electrically conductive durable oxide, or that is itself durable, electrically conductive, and non-oxidizable. During testing, the solder-bump I/O pads of the electronic device being tested are aligned with and pressed against the corrugated wiring areas of the given substrate. Alternatively, the electronic devices being of the electrically programmable variety, such as EPROMs, programming voltages can be delivered to each of the devices, one after the other, through the corrugated wiring areas of a single substrate.

REFERENCES:
patent: 4571540 (1986-02-01), Stowers et al.
patent: 4585991 (1986-04-01), Reid et al.
patent: 4937653 (1990-06-01), Blonder et al.
patent: 4987364 (1991-01-01), Watts
patent: 5010249 (1991-04-01), Nishikawa
patent: 5072116 (1991-12-01), Kawade et al.
patent: 5103557 (1992-04-01), Leedy
patent: 5177439 (1993-01-01), Liu et al.

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