Temporary connection of semiconductor die using optical alignmen

Details Temporary connection of semiconductor die using optical alignmen Temporary connection of semiconductor die using optical alignmen

1994-02-03

1996-01-09

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, G01R 3128

Patent

active

054831741

ABSTRACT:
Optical alignment techniques, such as those used in "flip chip" bonding, are used to establish ohmic contact with the die by means of raised portions on contact members. This permits accurate alignment with a temporary die fixture in order to test the die. The tested die can then be qualified under a known good die program as having an acceptable degree of reliability. This permits the die to be characterized prior to assembly, so that the die may then be transferred in an unpackaged form. The ohmic contact is preferably established by applying a compression force applied to the die against the substrate results in a limited penetration of the contact member into the bondpads. The arrangement may be used for establishing electrical contact and with a burn-in oven and with a discrete die tester.

REFERENCES:
patent: 3583561 (1968-06-01), Wiesler
patent: 3997963 (1976-12-01), Riseman
patent: 4554505 (1985-11-01), Zachry
patent: 4766371 (1988-08-01), Moriya
patent: 4968931 (1990-11-01), Littlebury et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5140405 (1992-08-01), King et al.
patent: 5213676 (1993-05-01), Reele et al.
patent: 5225037 (1993-07-01), Elder et al.

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