Etching a substrate: processes – Etching to produce porous or perforated article
Patent
1996-11-20
1999-01-05
Breneman, R Bruce
Etching a substrate: processes
Etching to produce porous or perforated article
156252, 156256, C23F 100, B32B 3100
Patent
active
058558039
ABSTRACT:
A cavity pattern for a laminated structure such as a substrate for integrated circuitry is formed in a sheet of unfired low temperature cofired ceramic (LTCC) material also known as "green" tape. One sheet at a time is placed in a flexible ram forming die including a resilient rubber pressure pad and a template including the pattern to be formed in the sheet. A pair of outer pressure plates hold the pressure pad and template in place. When a sheet of unfired LTCC material is placed between the pressure pad and template and pressurization is applied to the outer plates, extrusion of the rubber material through the template causes the tape to be sheared off at the edges of the holes in the template, thus effectively cutting the required pattern in the sheet. Following pressurization, the sheet now with the pattern cut therein is removed from the die and the residual tape cut-outs are subsequently removed from the template by a vacuum.
REFERENCES:
patent: 4737208 (1988-04-01), Bloechle et al.
patent: 5435875 (1995-07-01), Saitoh et al.
patent: 5538582 (1996-07-01), Natarajan et al.
patent: 5573622 (1996-11-01), Hass et al.
patent: 5683535 (1997-11-01), Karr
Bailey Alex
Chino John
Gupta Tapan
Starling Ronnie
Alanko Anita
Breneman R Bruce
Northrop Grumman Corporation
Sutcliff Walter G.
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