Image analysis – Applications – Manufacturing or product inspection
Patent
1995-10-31
1998-05-26
Boudreau, Leo
Image analysis
Applications
Manufacturing or product inspection
382146, 382209, 348 94, G06K 900, G06K 962
Patent
active
057579563
ABSTRACT:
A machine vision system for identifying the locations of bonding pads on an integrated circuit mounted in a lead frame. The system involves locating the bonding pads by searching an image with suitably rotated corner templates. A set of possible candidate bonding pads is created from the location of corner templates found during the search. The set is then scored utilizing matching criteria. The best candidate is selected from the set based upon the candidates' scores. The location of the bonding pad is then generated from the best candidate's corner template locations. The invention can be beneficially applied to locate bonding pads during wire bonding, as well as other machine vision applications.
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Koljonen Juha
Michael David
Tosa Yasunari
Boudreau Leo
Cognex Corp.
Mehta Bhavesh
Powsner David J.
Weinzimmer Russ
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