Temperature setting method of thermal processing plate,...

Details Temperature setting method of thermal processing plate,... Temperature setting method of thermal processing plate,...

2011-03-08

2011-03-08

Hoang, Tu B (Department: 3742)

Electric heating

Heating devices

With power supply and voltage or current regulation or...

C219S444100, C219S448110, C219S448120, C700S300000

Reexamination Certificate

active

07902485

ABSTRACT:
Temperature setting of a thermal plate is performed so that the line width of a resist pattern is uniformly formed within a wafer. The thermal plate of a PEB unit is divided into a plurality of thermal plate regions so that the temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting the temperature within the wafer mounted on the thermal plate is set for each of the thermal plate regions of the thermal plate. The temperature correction value for each of the thermal plate regions of the thermal plate is set after calculation by a calculation model created from a correlation between a line width of the resist pattern formed by thermal processing on the thermal plate and the temperature correction value. The calculation model M calculates the temperature correction value to make the line width uniform within the wafer, based on a line width measured value of the resist pattern.

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