Temperature setting method of thermal processing plate,...

Details Temperature setting method of thermal processing plate,... Temperature setting method of thermal processing plate,...

2011-03-01

2011-03-01

Paschall, Mark H (Department: 3742)

Electric heating

Heating devices

With power supply and voltage or current regulation or...

C219S494000, C392S418000

Reexamination Certificate

active

07897897

ABSTRACT:
In the present invention, a thermal plate of a PEB unit is divided into a plurality of thermal plate regions, and a temperature is settable for each of the thermal plate regions. A temperature correction value for adjusting the temperature within the thermal plate is settable for each of the thermal plate regions of the thermal plate. The line widths within the substrate which has been subjected to the photolithography process are measured, and an improvement in-plane tendency Za improved by change of the temperature settings is subtracted from an in-plane tendency Z of the measured line widths within the substrate to calculate an in-plane tendency Zb of the line widths within the substrate after change of temperature settings. The improvement in-plane tendency Za is calculated using the following expression.in-line-formulae description="In-line Formulae" end="lead"?Za=−1×α×MT(α: a resist heat sensitivity, M: a calculation model, and T: temperature correction values for thermal plate regions).in-line-formulae description="In-line Formulae" end="tail"?

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