Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2011-06-28
2011-06-28
Paik, Sang Y (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S444100, C396S611000
Reexamination Certificate
active
07968825
ABSTRACT:
A thermal plate of a heating unit is divided into a plurality of thermal plate regions, and a temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting a temperature within the thermal plate can be set for each of the thermal plate regions of the thermal plate. The line widths within the substrate which has been subjected to a photolithography process are measured, and an in-plane tendency of the measured line widths is decomposed into a plurality of in-plane tendency components using a Zernike polynomial. From the calculated plurality of in-plane tendency components, in-plane tendency components improvable by changing the temperature correction values are extracted and added together to calculate an improvable in-plane tendency of the measured line widths within the substrate. The change of setting of the temperature correction value for each of the thermal plate regions of the thermal plate is performed only when the magnitude of the improvable in-plane tendency exceeds a threshold value set in advance.
REFERENCES:
patent: 5640237 (1997-06-01), Esrig et al.
patent: 6457882 (2002-10-01), Ogata et al.
patent: 6722798 (2004-04-01), Senba et al.
patent: 2006/0198633 (2006-09-01), Tanaka et al.
patent: 2007/0254386 (2007-11-01), Asano
patent: 2009/0082911 (2009-03-01), Jyousaka et al.
patent: 2001-143850 (2001-05-01), None
patent: 2003-209093 (2003-07-01), None
patent: 2006-128572 (2006-05-01), None
Jyousaka Megumi
Ogata Kunie
Shinozuka Shinichi
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Paik Sang Y
Tokyo Electron Limited
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