Temperature regulator for burn-in board components

Heat exchange – With timer – programmer – time delay – or condition responsive... – Having heating and cooling capability

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165 803, 324760, 364557, F25B 2900

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active

055822355

ABSTRACT:
The present invention is directed to an apparatus suitable for regulating, with an impinging flow of gas, the temperature of an electronic component under thermal stress testing at selected temperatures. The apparatus comprises a sensor which senses the temperature of the electronic component and provides an electrical signal representative of sensed temperature to a controller. A gas flow regulator is used to control flow directed to impinge the flow of gas upon the electronic component as necessary to adjust the temperature. The gas flow regulator ms controlled by the controller which operates the regulator so as to adjust the temperature of the electronic components.

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IBM Technical Disclosure Bulletin, vol. 27, No. 7B, Dec. 1984 "Burn-In Fixture for Modules" by R. Brzyski, E. Grenchus, Sr., M. Rathod and R. J. Stutzman.
"Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric Liquid", The American Society of Mechanical Engineers; D. C. Wadsworth and I. Mudawart, pp. 79-87.
"Experimental Investigation of Single Phase Multi-Jet Impingement Cooling of an Array of Microelectronic Heat Sources" by L. M. Jiji and Z. Dagan, pp. 265-283.

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