Thermal measuring and testing – Temperature measurement – Composite temperature-related paramenter
Patent
1980-12-22
1983-05-24
Yasich, Daniel M.
Thermal measuring and testing
Temperature measurement
Composite temperature-related paramenter
374120, 374142, 376274, G01K 302
Patent
active
043847935
ABSTRACT:
The invention provides a method and apparatus for determining the approximate temperature profile of a large curved surface such as the outer surface of a chemical or hydrocarbon conversion reactor. At least two arrays of wire having a temperature dependent electrical resistance are placed over the surface to be monitored, with the arrays being aligned in different directions to cover the surface with a grid of overlapping wires. By measuring the resistance of each wire and comparing this resistance to predetermine reference values, wires which pass through regions of elevated temperature compared to the remainder of the surface may be located. By attributing the elevated temperatures to the area covered by the intersecting wires which show an increased resistance the areas of high temperature on the surface may be located. The system requires fewer connections and is simpler than a temperature monitoring system which requires a thermocouple or other temperature measuring means to be located at each corresponding intersecting grid point.
REFERENCES:
patent: 2944236 (1960-07-01), Anderson
patent: 2976729 (1961-03-01), Smith
patent: 3053091 (1962-09-01), Braunagel
patent: 3172730 (1965-03-01), Glassbrook et al.
patent: 3279256 (1966-10-01), Rainge
patent: 3470744 (1969-10-01), Lindberg
patent: 3577183 (1971-05-01), Gruenling
patent: 3719071 (1973-03-01), Hohenberg
patent: 3911727 (1975-10-01), Katsuta et al.
patent: 4102194 (1978-07-01), Eng
patent: 4176554 (1979-12-01), Kazmierowicz
patent: 4186605 (1980-02-01), Bourigault
Hoatson Jr. James R.
Page II William H.
Spears Jr. John F.
UOP Inc.
Yasich Daniel M.
LandOfFree
Temperature profile monitoring method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Temperature profile monitoring method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Temperature profile monitoring method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2144171