Temperature probe and method of making the same

Details Temperature probe and method of making the same Temperature probe and method of making the same

2010-01-26

2010-10-19

Lee, Kyung (Department: 2833)

Electrical resistors

Resistance value responsive to a condition

Ambient temperature

C338S025000, C374S135000, C073S180000, C029S610100

Reexamination Certificate

active

07817010

ABSTRACT:
A temperature probe assembly is provided. The temperature probe assembly may comprise a housing formed of a first thermally conductive material and having an inner diameter defined by an inner bore, an insert formed of a second thermally conductive material disposed in the inner bore and having an outer diameter that is substantially equal to the inner diameter of the housing at a first temperature and a temperature sensor mounted within the insert. The second thermally conductive material has a thermal coefficient of expansion that is greater than the first thermally conductive material, such that the insert is insertable into the inner bore at the first temperature and is tightly locked in the inner bore at a second temperature that is greater than the first temperature.

REFERENCES:
patent: 4011756 (1977-03-01), Lemos
patent: 5603571 (1997-02-01), Eckert
patent: 5864282 (1999-01-01), Hannigan et al.
patent: 6592253 (2003-07-01), Nyffenegger et al.
patent: 2513759 (1983-04-01), None
patent: 10 111180 (1998-04-01), None

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