Temperature modulated glue bead testing apparatus

Details Temperature modulated glue bead testing apparatus Temperature modulated glue bead testing apparatus

1985-03-28

1988-11-29

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

73150A, 118667, B29F 308

Patent

active

047879521

ABSTRACT:
A testing apparatus is provided for applying a glue bead to a first sheet of material and then adhering a second sheet of material thereto. The testing apparatus includes a glue tank and a glue head attached thereto both of which are adapted to measure and control the temperature of the glue therein. The glue head applies the glue to the first sheet of material at a preselected rate. The first sheet of material then passes to a compression cylinder which urges the second sheet of material into contact with the first sheet of material. The pressure and duration of the contact between the first and second sheets of material can be varied.

REFERENCES:
patent: T916005 (1973-11-01), Dolen et al.
patent: 2898816 (1959-08-01), Keely
patent: 3444732 (1969-05-01), Robbins et al.
patent: 3490278 (1970-01-01), Van Saun et al.
patent: 3743562 (1973-07-01), Phipps
patent: 4454084 (1984-06-01), Smith et al.

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