Thermal measuring and testing – Temperature measurement – In spaced noncontact relationship to specimen
Reexamination Certificate
2002-12-23
2008-11-04
Lefkowitz, Edward (Department: 2855)
Thermal measuring and testing
Temperature measurement
In spaced noncontact relationship to specimen
C374S141000
Reexamination Certificate
active
07445382
ABSTRACT:
Temperature measurement and heat-treating methods and systems. One method includes measuring a present intensity of radiation thermally emitted from a first surface of a workpiece, and identifying a present temperature of the first surface in response to the present intensity and at least one previous thermal property of the first surface. Preferably, the workpiece includes a semiconductor wafer, and the first and second surfaces respectively include device and substrate sides thereof. The present temperature of the device side is preferably identified while the device side is being irradiated, e.g. by an irradiance flash having a duration less than a thermal conduction time of the wafer. The device side temperature may be identified in response to a previous device side temperature, which may be identified in response to a previous temperature of the substrate side unequal to the previous device side temperature, and a temperature history of the wafer.
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Camm David M.
Kervin Shawna
Lefrancois Marcel Edmond
Stuart Greg
Jagan Mirellys
Knobbe Martens Olson & Bear LLP
Lefkowitz Edward
Mattson Technology Canada, Inc.
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