Temperature management for integrated circuits

Details Temperature management for integrated circuits Temperature management for integrated circuits

1994-04-28

1996-03-26

Kriess, Kevin A.

Boots, shoes, and leggings

3642645, 3642702, 3642328, 364DIG1, G06F 1740

Patent

active

055028381

ABSTRACT:
A system for controlling temperature buildup in an IC employs a temperature sensor to provide an indication of the IC temperature to a control circuit which is configured to provide an operational clock rate to the IC which is less than the system clock rate, based on a function of the temperature of the IC or its package. In one embodiment temperature sensors are implemented as solid-state circuitry within different functional areas of a single IC, such as a microprocessor, In other embodiments, operating voltage is lowered as operating frequency is lowered. In yet another embodiment temperature sensing of multiple processors in a system is provided to a controller or controllers which are configured to allocate workload between the processors as a means to limit temperature rise, as well as to lower operational clock rate and to lower operating voltage.

REFERENCES:
patent: 4092693 (1978-05-01), Ishikawa et al.
patent: 4625128 (1986-11-01), Boeckmann
patent: 4918505 (1990-04-01), Blouke et al.
patent: 5094546 (1992-03-01), Tsuji
patent: 5287292 (1994-02-01), Kenny et al.
patent: 5315214 (1994-05-01), Lesea
patent: 5359234 (1994-10-01), Atriss et al.

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